Split die bonding is a two-step process that involves pre-shrinking a protective sleeve over the bond area and exposing it to heat through heated split die, each with half the bond diameter. In contrast, split die bonding has shorter cycle times than hot air technology because the heated die is in direct contact with the material. Additionally, the split die configuration provides the advantage of being able to visually align the bonding locations with the heated areas of the die. These efficient machines are easy to use, easy to calibrate and easy to verify.